Mitigating the Hidden Costs of Semiconductor Obsolescence
January 1, 2026
Navigating Manufacturing Challenges By Dan Deisz, Rochester Electronics’ Vice President, Design Technology There are many factors in any semiconductor product “puzzle” that can lead to obsolescence. These pieces range from business revenue to subcomponents of semiconductor products, including foundry process technologies, packages, substrates, lead frames, test platforms, and design resources. The puzzle pieces often include […]
